Fabrication Data Acceptable:
- Item
- Production Capacity
- Layer Counts
- 1-32
- Material
- FR-4,Hi-TG FR-4,Halogen free FR-4,CEM3,Aluminum,Rogers,Polymide,Taconic,Ceramic
- Maximum Board Size
- 1120mm*635mm
- Board Outline Tolerance
- 0.1mm
- Board Thickness
- 0.20mm--10.00mm
- Insulation Layer Thickness
- 0.075mm-5.0mm
- Minimum Line Width/Space
- 3/3mils
- Mechanical Holes
- 0.15mm-6.35mm
- Min. Laser Drilling Size
- 4mil
- Max. Laser Drilling Size
- 6mil
- Toleracnce of Drill Size
- 0.05mm
- Max. Hole Copper Wall Thickess
- 70um
- Min.Gap Between Via and Conductor
- 6mils
- Min. BGA Pad Size
- 7mils
- Inner Copper Thickness
- HOZ-12OZ
- Outer Copper Thickness
- 1OZ-18OZ
- Min. Solder Mask Dam
- 0.08mm
- Min. Solder Mask Clearance
- 0.05mm
- Aspect Ratio
- 16:1
- Impedance Tolerance
- 10%
- Surface Finish
- HAL-LF,HASL,Immersion Gold,Immersion Silver,Immersion Tin,ENEPIG,OSP,Hard Gold Plating,Gold Fingers,Peelable Mask,Carbon Ink.
